以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
The critical thing to understand is namespaces are visibility walls, not security boundaries. They prevent a process from seeing things outside its namespace. They do not prevent a process from exploiting the kernel that implements the namespace. The process still makes syscalls to the same host kernel. If there is a bug in the kernel’s handling of any syscall, the namespace boundary does not help.
，这一点在雷电模拟器官方版本下载中也有详细论述
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